Romania Pakistan IT Forum Building Digital Partnerships

newsdesk
2 Min Read

Romanian official Dan Stoenescu met with Pakistan’s Federal Minister for Information Technology and Telecommunication, Shaza Fatima Khawaja, to discuss closer collaboration between the two countries’ IT sectors and plans for a bilateral industry forum to foster joint ventures, co-investment and knowledge exchange.

The meeting highlighted a personal connection between the two officials: both are alumni of the University of Warwick, which Stoenescu noted as a shared point of reference. Their discussion focused on strengthening ties between Romania and Pakistan in technology, trade and human capital development.

Romania was presented as a strong partner in the conversation, known for its large pool of skilled engineers, competitive operating costs and a robust presence of global tech firms. Romanian strengths cited include cybersecurity, fintech, artificial intelligence and software development, capabilities that could support international partnerships and technology transfer.

Pakistan’s rapidly growing IT ecosystem was emphasized as a complementary opportunity. The minister outlined the country’s progress in innovation and digital services and the potential to absorb investment, talent exchange and technical collaboration that could accelerate domestic growth while offering market access for foreign partners.

Both sides announced plans to organize a Romania–Pakistan Forum for the IT Industry in the near future. The event aims to bring together policymakers, business leaders and innovators from both countries to identify opportunities, facilitate partnerships and define a shared agenda for digital cooperation.

The officials said that closer Romania–Pakistan cooperation in IT and related fields could open new avenues for trade and investment, deepen human capital links, and connect their industries more effectively to broader European and South Asian markets.

Share This Article
Leave a Comment

Leave a Reply

Your email address will not be published. Required fields are marked *